Home

About Us

Products

Solutions

Portfolio

Your Project

Contact Us

Careers

Feedback

Customer Access

We now accept:

Robotic Assembly Equipment

We have over eighteen years of experience developing fully automated robotic assembly equipment.   We have delivered systems for for high volume semiconductor manufacturers like Intel, IBM, Motorola, AMD, Solectron & Delco.  We have delivered standalone workcells as well as full integrated lines.

Highlights of what we can offer: 

  • Expertise on following platforms:
    • ESEC/XPO CT-Series
    • ESEC Micron 2
    • Palomar 3500 Series
    • RD Automation M10
  • Expertise in the following assembly technologies:
    • SMT assembly
    • Flip Chip Assembly
    • BGA Assembly
    • TAB Assembly
    • Through-hole assembly
    • Epoxy & Adhesive Dispensing
  • Expertise in upgrading HW/SW on existing equipment
  • Expertise in complete HW/SW changes to retool existing equipment for a new process
  • Expertise in designing and building new robotic application from scratch

back to Solutions...

                                       Copyright © Engineering Process, Inc 2006-2007